Technical Talk Series


Semiconductor Packaging Technology Overview

18th October 2013, 10.00 am – 12.00 pm

Microprocessor Lab (D2.1.A)

Faculty of Engineering, UPM

Department of E&E Engineering, UPM and Texas Instruments Malaysia are pleased to invite all to TI-UPM technical talk series entitled ‘Semiconductor Packaging Technology Overview’ at Faculty of Engineering, UPM by Mr Edwin Lim Jin Keong. The event is co-organized by IEEE Circuits and Systems (M).


Semiconductor Packaging Technology Overview

The talk will provide an overview of Integrated Circuit (IC) Packaging Technology and the role it plays in the electronics/semiconductor ecosystem. Malaysia is a key industry player for semiconductor packaging and it would be vital to identify the driving forces and technology building blocks in the increasingly competitive industry. The talk would cover the following topics:

  • Overview of SC Industry
  • Drivers for Packaging Technology Development
  • Key Components of IC Packaging Technology
    • Form factors
    • Materials
    • Manufacturing Process
    • Packaging challenges
    • Future Trends


Biodata of speaker:

Edwin Lim Jin Keong

Edwin Lim is a Member Group of Technical Staff (MGTS) in Texas Instruments. He has more than 9 years of experience as a contributor in IC Package Development. His major responsibilities include development of materials, process technologies and executing technology roadmaps. He holds a Bachelors Degree in Mechanical Engineering from University of Malaya.


Contact us:
Department of Electrical & Electronics Engineering,
Universiti Putra Malaysia, 43400 UPM Serdang, Selangor.
Attention: Dr. Noor Ain Kamsani
Tel: +603 – 8946 6322                Fax: +603 – 8946 6327


View the PDF version here