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Archive for the ‘2016’ Category

2016 Career and Technical Talks by Intel Malaysia Design Center

Thursday, December 1st, 2016

25th April 2016, a career and technical talk was given by Intel Malaysia Design Center delegates at Faculty Engineering, Universiti Putra Malaysia, Selangor. The on-campus career talk is an annual event hold prior to student graduation with the objectives of to educate students on career at Intel Malaysia and sharing of advanced topics in IC design. Intel delegates consists of 8 managers and engineers from 5 Intel groups, namely Data Center Group (DCG), Device Development Group (DDG), Design and Technology Group (DTG), Intellectual Property Group (IPG) and Platform Engineering Group (PEG).There were about 80 students with engineering, science and technology background attended the talk. In the morning session, the event started with a brief introduction about Intel Malaysia Design Center and career opportunity at Intel. Then, each group manager presented their slides, focusing mainly on various design engineering positions in respective group’s job scopes and requirements, working environment and work culture.

There were about 80 students with engineering, science and technology background attended the talk. In the morning session, the event started with a brief introduction about Intel Malaysia Design Center and career opportunity at Intel. Then, each group manager presented their slides, focusing mainly on various design engineering positions in respective group’s job scopes and requirements, working environment and work culture.

Several key-points were discussed during the talk, which include the front-end design of a chipset for mainframe computers and cloud servers, system-on-chip design starting from RTL model to the physical design, and finally to silicon chip tape-out. The design technology solutions that are used across different design groups to improve work productivity were also discussed. In addition, IPG and PEG managers also discussed about the validation and verification on pre- and post-silicon for both processor and peripheral chipset. Lastly, Intel delegates shared the challenges for the engineering jobs such as working with teams of different time zone and working with colleagues of different countries with different cultures.

Following the session is an hour of networking session to promote deeper communication between students with the Intel delegates. Later in the afternoon session, Intel HR manager gave a talk on writing good resume and essential preparation for job interview.

The event is co-organized by IEEE CASS Malaysia chapter, IEEE COMSOC Malaysia chapter and Faculty of Engineering Universiti Putra Malaysia.

 

Written by: Lim Yang Wei & Tan Chee Phang

2016 APU, SEGI, MMU

Thursday, December 1st, 2016

In past few months, IEEE CAS Society Malaysia Section (IEEE CASS M) has successfully organized three IEEE membership drive events separately in different universities, including Asia Pacific University, SEGi University, and Multimedia University, which were located at Kuala Lumpur and Selangor regions.

During the membership drive events, Assoc. Prof. Ir. Dr. Harikrishnan Ramiah from University of Malaya had given a technical talk about “Empowering Nano-Scale CMOS Technology, with Emphasis on Analog/RF”. The events were attended by a total of 88 participants. The following table shows the exact date and location of the past membership drive events.

 

Written by,

Lim Yang Wei

Date Location Attendees
27th April 2016 Asia Pacific University, Bukit Jalil, Kuala Lumpur 30
19th July 2016 SEGi University, Petaling Jaya, Selangor 15
8th August 2016 Multimedia University, Cyberjaya, Selangor 43

Technical talk given by Assoc. Prof Ir. Dr. Harikrishnan Ramiah from University of Malaya at SEGi University (left) and the attendees to the membership drive event at Multimedia University (right)

2016 IEEE Membership Drive Event at UTM, Skudai

Thursday, December 1st, 2016

On 12th Jan 2016, an IEEE membership drive event was held at Universiti Teknologi Malaysia, Skudai, Johor. During the event, a technical talk title “Fundamental of CMOS Image Sensors” was given by Assoc. Prof. Dr. Suhaidi Shafie, which explained about the basic knowledge of charge coupled devices (CCD’s) and CMOS image sensors.

Second technical talk was presented by Dr. Fakhrul Zaman Rokhani entitled “Energy Efficient and Reliable NOC”. He discussed about a few NOC schemes that could achieve higher reliability at the same time having higher energy efficiency.

Later, Dr. Mohd. Amrallah promoted IEEE CAS Malaysia Chapter to the attendants by introducing the conferences and society activities which previously organized by IEEE CAS Malaysia Chapter.

 

Written/Edited by, Lim Yang Wei & Tan Chee Phang

2016 High Tea

Tuesday, June 14th, 2016

2016 IEEE CASS MALAYSIA

NETWORKING HIGH-TEA

 

Background Information

The IEEE Circuits and Systems Society (CAS) is the leading organization that promotes the advancement of the theory, analysis, design tools, and implementation of circuits and systems. The field spans their theoretical foundations, applications, and architectures, as well as circuits and systems implementation of algorithms for signal and information processing.

The Society brings engineers, researchers, scientists and other involved in circuits and systems applications access to the industry’s most essential technical information, networking opportunities, career development tools and many other exclusive benefits.

 

Objectives

IEEE CASS MALAYSIA Networking High-Tea is a yearly event which aims

  • To be a platform for intellectual interaction between IEEE member, fellows, engineers and academicians
  • To share knowledge and opportunities
  • To promote the IEEE CAS society programs and membership
  • To foster collaboration and cooperation

 

Target Audience

Our target participants are expected from

  • Industries and Research Institutes related to circuits and system.
  • Government and Funding bodies
  • Academicians from Local and International Institutions.
  • Undergraduate and Postgraduate Students of Local and International Institutions.

 

Theme:

Moving Forward with Internet of Things (IoT)

 

The Internet of Things (IoT) is a rapidly emerging application space, poised to become the largest electronics market for the semiconductor industry. The Internet of Things allows objects and processes to be sensed and controlled remotely across existing network infrastructure, creating opportunities for more direct integration between the physical world and computer-based systems, and resulting in improved living efficiency, accuracy and economic benefit.  IoT promises to be a broad driving force that will create significant new innovation, facilitate new business models and improve global society in unimaginable ways.

 

Date: 27th July 2016

Programs:

1.45 – 2.15 pm Registration
2.15 – 2.30 pm Welcoming remarks
2.30 – 3.00 pm Talk 1: Moving Forward with Internet of Things with UX Centered Software as Service

Mr Kamarul Zaman Abdul Rashid (Bio & Abstract)

Intel Malaysia

3:00 – 4.00 pm Talk 2: Rethinking ‘Things’ Design-the Missing (Technology) Link in the Internet of Things

Prof. Dr. Massimo Alioto (Bio & Abstract)

National University of Singapore

4.00 – 4.15 pm Break
4.15 – 4.30 pm IEEE CAS Award Giving Ceremony & Book Launching
4.30 – 5.00 pm Talk 3: Internet of Things: Opportunities and Challenges for Next-Generation Sensor Technology

Assoc. Prof. Dr Asrulnizam Abd Manaf (Bio & Abstract)

CEDEC USM

5.00 – 5.30 pm High Tea (Networking, CREST Lab Visit & Poster Exhibition)

*Membership drives counter will be opened throughout the session.

Location: SAINS@USM, Penang

Registration Fee: Free (IEEE CAS Members); RM20 (Non-IEEE CAS Members)

Event Poster : See HERE

 

Poster Submission

Contact Person          : Dr Mohd Tafir Mustaffa

Due Date                    : 10th  July 2016

Registration               : Free

Poster Format           : Download

 

Award Submission

Contact Person         : Dr Lini Lee

Due Date                    : 30th June  2016

More Detail                : See HERE

 

Photos

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Picture 1: Networking High-Tea Program Flyer

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Picture 2: 70 participants join our 2016 High-Tea Program Chair: Mohd Tafir Mustaffa

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Picture 3: Q&A to Dr. Alioto Massimo at High-Tea event

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Picture 4: A token of appreciation to Dr. Tat Kin Tan from Intel

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Picture 5: A group photo of IEEE CAS Malaysia members after High-Tea event

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Picture 6: Q&A to Dr. Alioto Massimo at High-Tea event

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Picture 7: A photo with Dr. Mohd Tafir Mustaffa (most left) the program chair

of 2016 IEEE CAS Malaysia High-Tea event

2016 Mr Kamarul Zaman Abdul Rashid

Tuesday, June 14th, 2016

Moving Forward with Internet of Things with UX Centered Software as Service

 

 IoT

SPEAKER:

 

Mr Kamarul Zaman Abdul Rashid

Intel Malaysia

 kamrul zaman

ABSTRACT: Internet of Things (IoT) will be the next big compute conundrum especially in providing effective and efficient solutions for harmonizing heterogeneous technologies together across billions of connected devices. IoT concept comes with the structure containing local sensor and devices that acts as Gateway, and connecting through the cloud. The three core technologies for IoT are often described to be including Connectivity, Manageability and Security, and are often supported by two basic layers of building blocks such as the hardware and software. While the hardware are made up by fabrics of physical building blocks, the software is needed to bind all aforementioned block of services together to offer unique and delightful usage experience to end users. Without software operating on top of the hardware, the hardware fabric remains monotonous. Without effectual software services, business model will not blossom. This talk is about the opportunity to bridge a gap in terms of software services in IoT. This presentation highlights the benefits of Service Oriented Architecture (SOA) and offers Software as a Service (SaaS) implementation in IoT for delivering embedded hardware features where often time hidden and not leveraged sufficiently thorough innovative software services delivery experience. Additionally, in terms of enriching software delivery experience, the presentation shall attempt to highlight the importance  of User Experience (UX) or Developer Experience as the center of future IoT SaaS, especially in delighting the Developers and the Community Ecosystem.

BIOGRAPHY: Kamarul received his Bachelor degree from the University of Southern Queensland in information technology and MBA from Universiti Utara Malaysia. Currently, he is a senior technical leader at Intel Malaysia with over 19 years of experience in setting technology vision, influencing the C-levels and leading world class teams in software architecture and business solutions designs using the latest state-of-the-art technologies and business capabilities. He also involved in Broad-based and versatile background encompasses IT management, software development, operations management and customer service.

2016 Prof. Dr. Massimo Alioto

Tuesday, June 14th, 2016

Rethinking “Things” Design – the Missing (Technology) Link in the Internet of Things

 

 

 

IoT

 

SPEAKER:

 

Prof. Massimo Alioto, Ph.D.

ECE – National University of Singapore

E-mail: massimo.alioto@nus.edu.sg, malioto@ieee.org

Homepage: http://www.green-ic.org/

 

ABSTRACT: The Internet of Things (IoT) has now become a main driver in research and next-generation technology development, and is expected to foster the growth of the semiconductor industry in the next decade or more, once the wave of mobile platforms reaches its peak.

In spite of daily announcements of new industrial projects in the IoT domain, the physical nodes that gather sensed data (the “things”) are still technologically immature, and well behind the rest of the IoT infrastructure. This lag has been determined by several daunting challenges in terms of energy efficiency and security under tight cost constraints, as well as a rigid view on the quality of service provided by IoT nodes. Energy efficiency is indeed synonym for node availability and size, whereas cheap chip-level security is a necessary premise to build adequate trust in the minds of potential adopters.

This talks addresses these fundamental issues and sketches a map to move towards the true realization of the physical layer of IoT, and ultimately enable IoT nodes with extreme energy efficiency and unceasing security, in both space (across nodes) and time (in each node). The scalable quality of service in IoT nodes is shown to be a key ingredient to relax the critical design tradeoffs, and generalize the well-known concept of “QoS” that is ubiquitously applied in the Internet of today. A perspective is finally given on the future role of technology and EDA industry in the IoT arena, based on the natural bottom-up (business) pressure that has made the Internet possible in the past. And will make the Internet of Things real in the future.

BIOGRAPHY: Massimo Alioto is Associate Professor at the ECE Department of the National University of Singapore, where he leads the Integrated Circuits and Embedded Systems area (80+ people) and the Green IC group. Previously, he was Visiting Scientist at Intel Labs – CRL (2013), Visiting Professor at the University of Michigan – Ann Arbor (2011-2012), University of California – Berkeley (2009-2011), EPFL – Lausanne (2007), and Associate Professor at the University of Siena.

He is (co)author of 220+ publications on journals (80, mostly IEEE Transactions) and conference proceedings, and three books with Springer. His primary research interests include ultra-low power VLSI circuits, self-powered/wireless nodes, circuits and systems for the Internet of Things, near-threshold circuits for green computing, energy-quality scalable VLSI circuits, circuits for HW-level security and for emerging technologies.

He is Associate Editor in Chief of the IEEE Transactions on VLSI Systems. He serves/has served as Associate Editor of several IEEE and ACM journals, and Guest Editor of various journal special issues. He is/was Technical Program Chair of several IEEE conferences (ICECS, VARI, NEWCAS, ICM), and Track Chair in several others (ICCD, ISCAS, ICECS, VLSI-SoC, APCCAS, ICM). In the last five years, he has given 50+ invited talks in top universities and leading semiconductor companies. He is/was Distinguished Lecturer (2009-2010) and member of the Board of Governors of the IEEE Circuits and Systems Society (2015-2017). Prof. Alioto is a Fellow of IEEE.

2016 Assoc. Prof. Dr Asrulnizam Abd Manaf

Tuesday, June 14th, 2016

Internet of Things: Opportunities and Challenges for Next-Generation Sensor Technology 

 

 IoT

SPEAKER:

 

Assoc. Prof. Dr Asrulnizam Abd Manaf

CEDEC USM

 Asrulnizam

ABSTRACT: The trend of Internet of Things (IOT) refers to the phenomenon in which not only computers, but all sorts of devices with embedded computing capacity are interconnected. Sensing, processing and connectivity are 3 key points to realize IOT in practical application. Based on report by Yole development at MEMS Engineer Conference 2015 at Tokyo, 4 main sensors will be main contributor for IOT. There are inertial sensor (accelerometer, gyroscope, magnetometer), environmental sensor (pressure, gas, humidity), optical sensor (CMOS,IR)  and microphone. However, current sensing technology will have limitation in no standardize for all sensor parameters, power consumption, sensitivity, response time, flexibility, reliability and life span. Thus, need a brilliant innovation in MEMS sensor to support the demand in IOT application especially in issue flexibility and power consumption.  In this talk will focus in current development of pressure sensor, flow sensor and incline sensor towards to flexibility of substrate, conductor material and robustness. As pressure sensor application is toward to subtle-pressure regime (1 Pa to 1 kPa) is defined as pressure created by weak interactions of small objects. A sensitive response to such subtle-pressures is necessary for the construction of ultra-sensitive skin-inspired electronic devices that mimic the properties of human skin for potential applications in advanced robotics, prosthetics, and health monitoring. Then, a novel flow sensor and incline sensor sensing technique by implementing of novel fluidic technology with Polymer fabrication technique in realize high robustness of sensor will be introduced. Then, by having a simple structure, high robustness and sensitivity, it can be compatible to integrate with a readout circuitry in realize a next generation sensor for IOT application.

BIOGRAPHY: Associate Professor Dr. Asrulnizam bin Abd Manaf received the Bachelor Engineering in Electrical and Electronic Engineering from Toyohashi University of Technology, Japan in 2001. Then, he worked as Electrical Engineer at Toyo-Memory Technology Sdn. Bhd at Kulim High Tech Park, MALAYSIA before he further his master degree at Toyohashi University of Technology, Japan. He received Master Engineering in Electrical and Electronic Engineering in 2005. He pursued his Ph.D study in Keio University, Japan in 2006. He received Ph.D in Engineering from Department of Applied Physic and Physico Informatics, School of Fundamental Science and Technology, Keio University Japan in 2009. Since 2009, he joined the school of Electrical and Electronic Engineering, Universiti Sains Malaysia as a senior lecturer. Then, promoted to Associate Professor in 2015. He has graduated 5 Ph.D students and 7 MSc students. Currently, 4 Ph.D students and 4 MSc under supervision. He has authored and co-authored 60 international technical journal or conference papers. He won several innovation award at national and International Invention competition. Currently he has 1 patent filing for DNA sensor. His current research interest includes development of microfluidic-based DNA sensor integrated with CMOS circuitry, miniaturized of fluidic-based inclination sensor, bio inspired based microfluidic acoustic, pressure and flow sensor for underwater system, micro fluidic based memristor, micro fluidic based tuneable inductor, fluidic micro Thermoelectric Generator (mTEG)-based energy harvesting, Graphene-based transistor and micro 3-dimension fabrication technique by using grayscale Technology.